<p>chip silicone gel in the heating process to produce bubbles Adhesive patch Silicone curing speed is too slow, resulting in leakage of glue causes: LED SMD silica gel at high temperatures due to molecular  motion faster, resulting in viscosity thinning. Low refractive index gel thinning is not obvious, high refractive index gel because it is mainly composed of a silicone oil with phenyl, phenyl steric hindrance than the average low refractive index glue to large gum crosslinking speed is lower, the viscosity change Thin phenomenon is very serious. </p><p>Solution: Some manufacturers set the curing temperature of the glue at 100 �� / h, so there is a leakage of glue, can be changed to 150 �� / 1h curing, the basic problem can be solved; Or choose to buy a little higher viscosity  silica gel, the problem can be Avoid, LED chip silicone curing speed is too slow, resulting in leakage of glue causes: LED SMD silica gel at high temperatures due to molecular motion faster, resulting in viscosity thinning.</p><p> Low refractive index gel thinning is not obvious, high refractive index gel because it is mainly composed of a silicone oil with phenyl, phenyl steric hindrance than the average low refractive index glue to large gum crosslinking speed is lower, the viscosity change Thin phenomenon is very serious. Basic can solve the problem; Or choose to buy a little higher viscosity silicone, the problem can be avoided. LED paste silicone gel inside the tackifier and the components of the hydrogen Fireproof Decking Products - Seven Trust
silicone oil reaction, resulting in hydrogen, causing air bubbles (the glue failed, can not be used).</p><p> LED chip mechanical strength of silicone is too poor, the curing process due to the overall degree of solidification of the plastic stress dispersion uneven, local gel torn, resulting in bubble-like things. Plastic injection process of plastic flow too fast, can not fully guarantee the plastic base and led wetted completely, resulting in bubbles. The silver paste and the chip of the fixed chip have voids. After the glue is injected, the voids will form bubbles at the chip, and the bubbles will  become larger when heated.</p>